Work Package 4

Virtualization – Digitalization

The work package focuses on the creation of solutions for control, tracking communication and collaboration of a swarm of SNS within its production environment (Swarm Intelligence), Advanced Wafer Transportation & AMHS Logistics – data processing for improving the fab performance in terms of relevant key parameters.  Chip Trancing which means to cover all aspects about data handling from front end to back end facilities assuring and improving all relevant quality data. The transformation of complex image data into a simple format and in methods for further data processing within the APC database algorithms and finally Energy Data Management with the focus on energy efficiency of equipment.

WP Leader: IFD (Infineon Technologies Dresden GmbH, Deutschland)

WP Partner: IFAT(A); FKL(A); MCL(A); IFD(G); IFAG(G); TUD(G); BOSCH(G); SYSTEMA(G); ZNT(G); RR-O(G); MLAB(G); HSMW(G); ELMOS(G); UNIPV(I); SA(G)